Lead Free Soldering Machine

Specification

• Securing the smallest set-up Space by having N2 producer in the machine
• Special design is applied to Bath and Finger to do Pb-free soldering
  • Bath : Apply special coating to prevent corrosion by Pb-free solder
  • Change Solder heating method : Prevent corrosion by Pb-free solder with setting up outside the bath
  • Finger : Apply special resin to prevent sticking of solder
• Apply intermittence classification system to prevent oxidation
• Secure the largest heating zone of Pre-heater to consider Solderability of Pb-free solder.
• Prevent temperature drop by the smallest distance between 1st classification and 2nd one.
• Bath structure is changed to Package type to reduce N2 consumption and prevent from inflow of oxide materials.